Very fine pitch test probes are always used for contacting the very close test points, the feet or pad are very small distance printed or soldered on BGA chips or connectors, which can't be touched by standard and big test probes. These fine pitch probes are usually fixed without any receptacle, and can reduce an enough space for pitch. Fine pitch pogo pins series semiconductor probes are composed of high-precision and uncommon materials, G4 barrels and Palladi ium alloy with high-current capacity. Those speacial test pobes bring you. Possibilities To Contact Small Pads and Printed Feet In Fine Pitch. High Current Capacity High Frequency Possibility High Speed Tranmission Sandwich Assembly Fixture or Socket Design High Accuracy Contacting Ability Not Too Much Material Wasted Stable Contact and Test with a long durability