CY-SPC-HUA6 is a small and flexible spin coater, which can spray the glue on the substrate through the ultrasonic nozzle, and then evenly apply the glue on the substrate through high-speed rotation. It is also possible to directly perform the spin coating operation alone.
1. The chamber is equipped with heating elements, which can be baked after spinning coating
2. The product has a gas path controlled by a 2-way float flowmeter, which can pass inert gas into the chamber to protect the glue liquid from the gas in the air when spinning coating
3. This machine is suitable for surface coating of semiconductor wafer, slide, wafer, substrate, ITO conductive glass and other processes and plate making.
4. The maximum size of the crystallizable wafer is 6 inches, the rotational speed can reach 10000rpm, and the acceleration can reach 5000rpm;
5. It has the advantages of stable speed, quick start, convenient operation, etc., and can ensure the consistency and uniformity of the thickness of spinning coating.

product features
1. Adopt DC brushless motor, single chip microcomputer control
2. High-definition touch screen control
3. Single step and multi-step spinning coating operation can be carried out, five programs can be stored, and each program can be set with five steps of operation
4. Anti-blocking glue design
5. Aluminum alloy chamber, durable
6. It has various auxiliary functions such as ultrasonic, atmosphere, heating and so on, which can be used for spinning coating research